陈俊菲,张元标,林 聪.随机振动下产品包装系统的传递路径数值仿真与实验研究[J].振动工程学报,2023,36(6):1633~1646.[CHEN Jun-fei, ZHANG Yuan-biao, LIN Cong. Numerical simulation and experimental study of the transfer path of product packaging system under random vibration[J]. Journal of Vibration Engineering,2023,36(6):1633~1646.]
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